显示标签为“Laser Drilling Machine”的博文。显示所有博文
显示标签为“Laser Drilling Machine”的博文。显示所有博文

2015年9月30日星期三

Laser Drilling Applications in the PCB Industry

Two kinds of laser technique can be used in laser drilling of PCB. CO2 laser wavelength is within far ultrared-ray waveband and ultraviolet laser wavelength is within UV band. CO2 laser is widely used in micro-vias production of printed circuit board, requiring micro-vias' diameter greater than 100μm (Raman, 2001) . It has high productivity in large-size hole manufacturing since it needs very short time to finish punching by CO2 laser. UV laser technique is widely applied in micro-vias production, with diameter less than 100μm even 50μm. It has very high output when produce holes with diameter less than 80μm. Therefore, more and more manufacturers have brought in double-ended laser hole-drilling system in order to meet the increasing demand of micro-vias production.
laser drilling
laser drilling
Below are the three main types of double-ended laser hole-drilling system in current market:
1) double-ended UV drilling system;
2) double-ended CO2 laser drilling system;
3) mixed laser drilling system (with both CO2 and UV) .

Each type has its merit and demerit. Laser drilling system includes double-ended single wavelength system and double-ended dual-wavelength system. Two parts influence the drilling quality:
1) laser power / pulse energy;
2) beam positioning system.

Laser pulse energy and transmission efficiency of beam decide the drilling time, which means the period of time needed to drill a micro-via by laser drilling machine. Beam positioning system decides the speed of movement between two holes. The speed of laser drilling machine is determined by all the factors together. Double-ended UV drilling system is ideally suited to drilling less than 90μm in integrated circuit, with high aspect ratio.

Double-ended CO2 laser drilling system makes use of Q-switch RF-excited CO2 laser. It's principle advantages include high repetition rate (which reaches to 100kHz), short drilling time and wide interface.

In the HDI manufacturing process, mixed laser drilling system is the most popular system composed of UV laser head and CO2 laser head. The comprehensive application of mixed laser drilling methods allows both copper and dielectric medium drilling occur at the same time. Ultraviolet radiation drill the copper to form a particular size and shape, and CO2 laser drill the uncovered dielectric adjacently. The drilling process is to drill a 2inX2in area, which is called domain.
co2 laser
co2 laser
CO2 laser can remove dielectric effectively, even the non-uniform glass-reinforced dielectric. However, it is unable to drill hole less than 75μm and remove copper, with an exception of pre-treated thin copper foil (lustino, 2002) less than 5μm. UV laser can drill very small holes and erase every ordinary copper (3-36μm, 1oz, even electro copper foil). It can also erase dielectric material by itself but it is quite slow. And the result is not good on non-uniform materials like glass-reinforced FR-4. It is because that only when the energy density is improved to some extent, the glass can be successfully removed but bonding pad will be destroyed in the meantime. Since mixed laser drilling system contains both CO2 and UV laser, it can achieve the best result in the two fields, with UV laser in copper foil and small hole and with CO2 laser in fast drilling on dielectric.

At present, the distance between the two heads is fixed in most double-ended laser hole-drilling system, with stepping-repeat beam positioning technology. Stepping-repeat laser remote controller has large regulating range, reaching to 50X50 μm. Its disadvantage is that the laser remote controller has to move in the fixed area, and the separation distance between the two heads is fixed as well. Typical separation distance between the two heads is about 150μm. It is impossible to get the optimum allocation operation like programmable head when it comes to different panel sizes.

Nowadays, there are various specification of performance for double-ended laser hole-drilling system, which can apply to small printed circuit board manufacture as well as mass production.
laser hole-drilling
laser hole-drilling
Ceramic aluminum oxide is used in printed circuit board manufacture for its high dielectric constant. But it is frangible and the mechanical pressure in drilling need to reduce to the minimum, which is an advantage for laser drilling. Rangel had proved in 1997 that Q-switch Nd - YAG laser drilling can be applied in aluminum oxide baseboard and aluminum oxide baseboard covered with gold and anchor. Laser with short pulse, low energy and high-peak power can protect sample from mechanical pressure and make high quality hole less than 100μm.

2015年7月2日星期四

Laser Drilling Machine and Its Benefits

If you need to begin a little business or own one, then you should be mindful that laser drilling and laser imprinting machines are currently accessible in the business sector and give productive evaluations that huge machines don't require for your etching assignments. These drilling and imprinting machines are intended to plan and imprint materials, for example, metal, wood, plastic among others. With these machines, it is conceivable to make outlines on furniture, gems, and wooden questions et cetera.

Laser drilling machine and laser etching machines in the advanced days can now be controlled with the utilization of PC programming. With this framework, you can etch any design or photos of your decision. It is must be noticed that you can likewise etch your photo all the more effectively. This should be possible when you take your photo and transfer it on your machine. You will then utilize this product to import, resize furthermore custom it to laser pace. With these procedure done, you can now print your photo utilizing the etcher.

Laser Drilling Machine

Laser drilling is with most likely turning into a more prominent practice in the present day world. This is on account of it has assumed control over the customary mechanical drilling, punching.This technique can be utilized as a part of drilling little holes that have extensive profundity to width proportion. This drilling is likewise ready to make exact holes that can be recreated at any given spot. Laser drilling innovation is suitable for a wide range of creation and assembling commercial enterprises.

There are two sorts of laser drilling. One of these systems is percussion drilling and it is done dully beating centered laser vitality on the surface of the material, which then vaporizes every layer until a wanted gap is accomplished. The second strategy is the utilization of trepanned laser drilling which is perfect when you have to get vast holes. Utilizing this strategy will give you tube shaped or round circle from substrate. Not at all like the percussion drilling, substrate position is moved in jumble with the foreordained gap size.

Laser drilling gives consistency to commercial ventures or organizations that have specific assembling specifications. This procedure gives lively 'on the fly' changes to give quality opening profundity and quality. This has seen most holes, for example, formed holes that have boundless geometry can now be penetrated. These shapes were unrealistic utilizing ordinary drilling procedures.

Laser drilling is likewise quick and an exact procedure that have a few advantages. This is on account of it works in practically different fields. This innovation is certainly more focused contrasted with the foster drilling systems. You likewise need to realize that PCB Drilling machine can now be utilized for etching. This is a result of headway in innovation where a PC is presently used to control laser shaft that is coordinated or pointed at an article that is to be engraved. As the laser moves, little spots of materials are evacuated and that the picture is made line by line like those created by an inkjet printer meets expectations.



Laser Drilling Benefits

Non-contact transform (no tooling wear or breakage, insignificant material mutilation);

Exceptionally exact and reliable results;

Exact control of warmth information;

Capacity to deliver little distance across holes with high perspective proportions;

Simplicity of programming and versatility to computerization;

Expanded creation rates with speedier setup times and less tooling;

Adaptability in changeovers for models and little cluster assembling;

Adaptability (the same apparatus can be utilized for laser welding and laser cutting);

Limit for a high level of pillar control

Capacity of some laser frameworks to penetrate different components at the same time;

Capacity to process an extensive variety of materials.

Percussion laser drilling machine

Percussion laser drilling means changing the laser's center spot size to focus the gap size. There is no relative movement between the laser pillar and the part amid the drilling procedure. The parameters and number of heartbeats are decided to deliver a decent quality gap.

Laser driling holes in the 25m to 1000m measurement reach is conceivable utilizing this technique however the points of confinement differ as indicated by the material. Most percussion bored holes are in the 300m-600m breadth range.

Percussion drilling permits an extraordinary drilling administration termed drilling 'on-the-fly' to significantly build gap drilling pace. Drilling on the fly is normally performed on round turbine motor parts and uses signals from the movement frameworks encoders to trigger the laser at specific, reliably divided gap areas around the part.

If ten heartbeats are obliged to percussion bore an opening then a drill on-the-fly framework will turn the section ten times ,sending a laser heartbeat to every gap area per upset. Laser drilling velocity is expanded on the grounds that indexing time is dispensed with from the process duration.

Percussion drilling can exploit heartbeat molding to enhance the collaboration of the laser bar with the material. This can likewise help control decrease and enhance the drilling rate.

Heartbeat molding is modifying the laser's heartbeat fleeting profile. By separating a long drilling heartbeat into two three or four shorter portions, isolated by off-time, the opening quality can be enhanced and rate expanded. Flotsam and jetsam leaving the gap can meddle with end of a long term beat so separating it enhances proficiency and diminishes drilling time. Utilizing a heartbeat shape with a lower crest force section toward the starting can make a gap that has less beginning ringer mouth decrease.

Trepan laser drilling

Trepan laser drilling obliges a movement framework to permit penetrating with the laser and after that movement of the shaft in respect to the part to "cut" out the gap. Trepanning considers a measurement resistance about a large portion of that of percussion drilling. It empowers the making of molded holes with a customized decrease or changing cross area with profundity utilizing a multi-pivot framework. This obliges a framework with great precise movement ability and abnormal state programming capacity. Trepanning additionally empowers the cutting of specific shapes and extensive holes and complex 3D trimming of expansive parts.



Holes penetrated in metals are judged by the gap distance across resilience, decrease, recast thickness, and miniaturized scale breaking. Opening breadth in percussion bored holes is for the most part not exactly +/ - 50m and in trepanned holes the resistance fixes to about +/ - 25m. Recast is the liquid metal that resolidifies around the opening's inward measurement. Recast thicknesses shift with the compound and gap profundity however is for the most part under 100m.