Plated 0.1tmm 4" 3N7 Molybdenum Thermal Mounting Base For GaAs-Basd LED Red Chip Heat Sink

Plated 0.1tmm 4" 3N7 Molybdenum Thermal Mounting Base For GaAs-Basd LED Red Chip Heat Sink on en.OFweek.com





Product Specifications/Features

Material: Pure Molybdenum

Thickness: 0.1mm

Size: 4"

Surface Condition:Polishing and Grounding

Surface Roughness: 0.03um, Mirror Surface;

Coating: Ni/Au coating

Standard of Plating:

Withstand 500 degrees baking verification by 15 minutes.

Withstand 3M adhesive tape test after scribe the surface to 1x1mm space.

Uniformity of coating thickness: within +/-15%.

No peeling, bubbles, delamination, water stains, dents; No visible scratches; Uniform color

Surface Roughness changes within 0.01um after plating.

Gold Purity: 99.99%